PLANAR (KBTEM)
 
EМ-6129 Automatic unpatterned wafer defect inspection system

 

EМ-6129 Automatic unpatterned wafer defect inspection system

EМ-6129 is designed to inspect unpatterned wafers for surface сontamination.

The system allows both to perform final inspection at wafer fabs and the incoming inspection in the production of chips.

 

Specifications 

Minimum detected defect size, nm35-45
Minimum defect size detection probability0.95
Throughput, wafers per hour80
Wafer diameter, nm150, 200
(option 300)
Power consumption, not more than, kW700