EМ-6015M Automated wafer inspection system


EМ-6015M Automated wafer inspection system

The tool is designed for automated inspection and detection of contaminants and defects on the surface of wafers and masks protected on both sides with pellicles. The inspection is carried out in the bright and dark field of reflected and transmitted light.

Main features:
- automated operation, user programmed inspection route;
- automated defect data processing (image, coordinates, dimensions) with data saving to database;
- automatic focusing;
- extended focal distance lenses;
- touch screen;
- design modularity



Numerical apertures of a set of lenses 0.03 ... 0.5
Magnification range 20х ... 500х
Lens working distance, mm 11
Linear fields of view, mm 0.45 ... 10
Range of inspected dimensions, µm 1 ... 120
Data presentation resolution under linear dimension assessment, µm 0.01
XY stage travel, mm 200х200
XY stage speed range, mm/s 0.02 ... 20
XY stage motion step, µm 1.0
Power consumption, not more than, W  500