EM-5096 Mask aligner

EM-5096 system is designed to align the photomask pattern and the wafer pattern and to transfer the pattern from the photomask onto the wafer through the contact (proximity) exposure of the wafer photoresist layer.

EM-5096 features the following automatic systems:
- wafer wedge and thickness compensation without contact with the photomask;
- operator controlled alignment proximity;
- wafer photoresist exposure;
- energy saving mode;
- alignment mark alignment error definition on photomasks and wafers.

Double field microscope with smooth magnification adjustment.

Loading-unloading of wafers and substrates onto the chuck is performed by the operator manually.


Working wavelengths*, nm225-260; 280-335; 350-450
Photolithography resolution, µm0.4 ... 0.6
Illumination uniformity across 76-mm diameter working field, %±2
Alignment accuracy random component, μm±0.1
Wafer diameter*, mm76 (16, 20, 25, 30, 40, 50, 60) 60x48; 48x30
Mask size*, mm76x76; 102х102
Alignment manipulator drive sensitivity: 
- along X, Y, μm0.01
- angular, seconds0.1
Double field microscope with smooth magnification adjustment: 
- OM 0.4/8 objectives and 10x eyepieces 150х ... 480х
- OM 0.2/14 objectives and 10x eyepieces90х ... 250х
Power consumption, not more than, W800
*Subject to customer requirements