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TOOLS FOR PROXIMITY EXPOSURE AND DOUBLE-SIDE LITHOGRAPHY |
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EM-5026xx series and EM-5096 tools are intended for pattern
alignment on photomasks and wafers (substrates) and further transfer of
this pattern from mask to wafer through contact (proximity) exposure of
wafer photoresistive layer.
Main features:
- wedge compensation and wafer thickness compensation without contact with the photomask;
- 3 coordinates (X, Y, Q) high precision wafer manipulator with coarse and fine alignment modes;
- ability to handle 0.2 mm to 0.8 mm wafers made of fragile materials (GaAs, LiNbO3) and rectangular substrates;
- built-in vibration protection unit;
- energy saving mode.
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PLANAR (KBTEM)
