Tools for proximity exposure and double-side lithography
EM-5026xx series and EM-5096 tools are intended for pattern alignment on photomasks and wafers (substrates) and further transfer of this pattern from mask to wafer through contact (proximity) exposure of wafer photoresistive layer.
- wedge compensation and wafer thickness compensation without contact with the photomask;
- 3 coordinates (X, Y, Q) high precision wafer manipulator with coarse and fine alignment modes;
- ability to handle 0.2 mm to 0.8 mm wafers made of fragile materials (GaAs, LiNbO3) and rectangular substrates;
- built-in vibration protection unit;
- energy saving mode.
EM-5026AM Mask aligner
EM-5096 Mask aligner
EM-5026M1 Mask aligner
EM-5026B Double-side mask aligner
EM-5186 Double-side alignment mark placement system