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The wafer stepper is designed for alignment and die-by-die exposure of wafers in the production of LSIs, VLSIs and other electronics devices.
The stepper operation is based on the step and repeat transfer (multiplication) of reduced in size reticle image onto a prefocused and aligned with the reticle image plane semiconductor wafer oriented with reference to special alignment marks placed on its working surface.
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Specifications
| Operating wavelength, nm |
404 |
| Photolithographic resolution, µm |
0.8 |
| Reduction ratio |
1:5 |
| Throughput (150 mm diameter wafer ), wafers per hour |
50 |
| Maximum working field size, mm |
16 х 16 |
| Alignment accuracy random component, nm |
±100 |
| Wafer diameter (changeable), mm |
100, 150, 200 |
| Reticle size, mm |
127 х127 |
| Reticle library capacity, pcs |
10 |
| Power consumption, not more than, kW |
4 |
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