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EМ-5026B Double-Side Mask Aligner |
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The EM-5026B system is designed to perform a
contact (proximity) exposure of the top (front) side of a wafer or a
substrate through alignment of the photomask pattern with the pattern on
the bottom (back) side of the wafer or substrate.
EM-5026B features the following automatic systems:
- high precision pre-orientation;
- wafer loading/unloading on a chuck;
- wafer wedge and thickness compensation without contact with the photomask;
- automatic alignment proximity adjustment;
- photoresistive layer exposure on wafers;
- energy saving mode.
Semiautomatic wafer loading/unloading.
| Working wavelengths*, nm | 225-260; 280-335; 350-450 | | Photolithography resolution, µm | 0.4 ... 1.0 | | Illumination uniformity across 110 mm diameter working field, % | ±2.5 | | Alignment accuracy random component: | | | - one side alignment, µm | ±0.2 | | - with reference to marks on the back side, µm | ±1 | | Wafer diameter*, mm | 40; 50; 60; 76; 100 | | Mask size*, mm | 76x76; 102x102;127x127 | | Alignment manipulator drive sensitivity: | | | - along X, Y, µm | 0.01 | | - angular, seconds | 0.1 | | Power consumption, not more than, W | 900 | | *Subject to customer requirements |
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PLANAR (KBTEM)