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EМ-6129 Automatic unpatterned wafer defect inspection system |
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EМ-6129 is designed to inspect unpatterned wafers for surface сontamination.
The system allows both to perform final inspection at wafer fabs and the incoming inspection in the production of chips. |
Specifications
| Minimum detected defect size, nm |
35-45 |
| Minimum defect size detection probability |
0.95 |
| Throughput, wafers per hour |
80 |
| Wafer diameter, nm |
100, 150, 200 |
| Power consumption, not more than, kW |
700 |
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