|
EМ-6129 Automatic unpatterned wafer defect inspection system |
|
|
EМ-6129 is designed to inspect unpatterned wafers for surface сontamination.
The system allows both to perform final inspection at wafer fabs and the incoming inspection in the production of chips. |
Specifications
| Minimal detectable defect size, nm |
28 nm High sensitivity, LT
45 nm Low sensitivity, HT |
| Detection channel number |
2 |
| Wafer diameter |
150, 200, 300 mm |
| Throughput (wafer/hour) |
120 |
| Non-flatness inspection |
available |
| Laser source |
continuous solid-state laser, λ =355 nm, (100 – 200) mW |
| Beam incidence |
3 modes: normal, oblique, Bright Field |
| Collection |
2 channels – wide and narrow |
| Detection |
PMT sensor module |
| Scan mode |
scanstage rotation with radial motion (spiral scanning) |
| Scan spot size |
2 modes:
– high sensitivity, low throughput – 10х100 um,
– low sensitivity, high throughput – 10х300 um
|
| 200 mm wafer scan time |
– high sensitivity – 50 s,
– low sensitivity - 20 s
|
| Focusing |
automatic |
| Visual channel |
Optical Microscope with 0.1-0.45 um resolution and 0.3 mm field with image displaying (λ=365 nm, К=24, NA=0.5) |
| Number of displays |
2: one for defect displaying and one for operator interface |
| Cassette station type |
open cassette stations, or different station types upon request |
|
PLANAR (KBTEM)