«KBTEM-OMO»
JOINT STOCK COMPANY
 
EМ-6529 Automatic patterned wafer macro defect inspection system

 

EМ-6529 Automatic patterned wafer macro defect inspection system

EМ-6529 is designed to automatically inspect patterned and unpatterned wafer surface macro defects at various stages of production, including the final outgoing inspection (FOI). 

The inspection is performed simultaneously in bright-field and dark-field modes using the die-to-database comparison method.

 

Specifications 

Minimum detected defect size, µm 50
Minimum width detected scratches, µm 20
Inspection throughput for wafers:  
100 mm diameter, w/hr 110
150 mm diameter, w/hr 67
200 mm diameter, w/hr 45
Power consumption, not more than, kW 1.5

 

 
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