EМ-6239 Automated micro size inspection system

The tool is intended for automated inspection of pattern critical feature size on silicon wafers. Wafer loading/unloading is automatic.

The size inspection is carried out at 365 nm wavelength. The pattern is observed in visible light.

Size range of inspected features for X and Y, µm 0.5 ... 30
Mean root square deviation of size inspection, not more than, nm 2
One feature inspection time, not more than, s 1
Observation field size, mm 1.7x1.3
Magnification, not less than 8000
XY stage motion range along X and Y, mm 150
X Y stage positioning sensitivity, not more than, µm 0.1
Power consumption, not more than , kW 800