Large-area steppers

The large-area stepper family is developed by KBTEM-OMO for the flip-chip assembly of high-end chips with numerous output contacts. The flip-chip packaging in many respects determines functional performance of a chip and meets evergrowing demand for higher electrical parameters, further miniaturization, higher reliability, heat and power control at stable cost decrease.


We invite you to visit us
at our booth in
Shanghai New International
Expo Centre
Shanghai, China
March 20-22, 2019
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