PLANAR (KBTEM)
 
EM-6729B and EM-6729-0.25 Automatic mask inspection systems

EM-6729B and EM-6729-0.25 systems are designed for automatic inspection of reticles and work photomasks having transparent and opaque defects: pindots, pinholes, protrusions, mouse bites, shorts between features, breaks, corner roundings, size shifts, half-tone defects, etc.

The automatic defect inspection is realized through a die-to-database comparison method. After completion of inspection cycle, the defect list is formed and the operator can observe the defects on the display screen.

 

SPECIFICATIONS

 EM-6729BEM-6729-0.25
Minimum detected defect size, µm0.150.25
Inspection time of 100x100mm area, min3025
Inspection time of 100x100mm area with doubled pixel, min1815
Working field size, mm153х153
X-Y stage resolution, nm5
Visual channel magnification factor150, 600, 2000
Reference image feature size correction range, nm50 ... 250
Defect programmed filtering range, µm0.15 ... 1.5
Pellicle frame maximum height (at each side of a mask), mm6,5
Data formatsZBA, GDS, MEBES, DXF, other formats are optional
Power consumption, not more than, kW1.8