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EM-6329B and EM-6329R Automatic mask inspection systems |
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EM-6329B and EM-6329R systems are designed for automatic inspection of reticles and work photomasks having transparent and opaque defects: pindots, pinholes, protrusions, mouse bites, shorts between features, breaks, corner roundings, size shifts, half-tone defects, etc.
The automatic defect inspection is realized through a die-to-database comparison method. After completion of inspection cycle, the defect list is formed and the operator can observe the defects on the display screen.
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Specifications
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EM-6329B |
EM-6329R |
| Minimum detected defect size, µm |
0.15 |
0.25 |
| Inspection time of 100x100mm area, min |
25 |
| Inspection time of 100x100mm area with doubled pixel(0.5µm), min |
7 |
| Working field size, mm |
153х153 |
| X-Y stage resolution, nm |
5 |
| Visual channel magnification factor |
150, 600, 2000 |
| Reference image feature size correction range, nm |
50 ... 250 |
| Defect programmed filtering range, µm |
0.25 ... 2.5 |
| Pellicle frame maximum height (at each side of a mask), mm |
8 |
| Data formats |
ZBA, GDS, DXF, EM-5x09, EM-5x89 |
| Power consumption, not more than, kW |
1.8 |
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