EМ-5131 Laser-based mask defect repair system |
The tool allows to repair masks with various masking coating: chromium, chromium oxide, and iron oxide.
Main features:
- removal of opaque defects;
- repair of transparent defects;
- femtosecond laser allows to perform damage-free processing of the mask substrate;
- TV observation of defect finding, alignment and stage travel to the specified zone of a defect;
- angular mask orientation and reference system binding;
- process parameter setting in automatic and manual modes.
SPECIFICATIONS
Minimum diametr of defects under repaired, µm: | | - transparent | 1 | - opaque | 0.5 | Working field size, mm | 160х160 | Angular position of an area under repair, degrees,° | ±45 | Accuracy of laser beam pointing at an opaque defect, nm | 500 | Opaque defect programmable size resolution, nm | 100 | Power consumption, not more than, kW | 4 |
PERFORMANCE SPECIFICATION
Objective lens magnification |
100x |
75x |
30x |
7.5x |
Objective Lens Working Distance, mm |
2,2 |
7,5 |
7,5 |
18 |
XY Stage Minimum Step Size, nm |
50 |
50 |
50 |
50 |
XY Stage Defect Navigation Accuracy, um |
±5 |
±5 |
±5 |
N/A |
Edge Placement Accuracy, nm |
±50 |
±70 |
±100 |
N/A |
Opaque Defects: |
Yes |
Yes |
Yes |
No |
Minimum Edge Defect Size, nm |
200 |
300 |
500 |
N/A |
Minimum Isolated Defect Size, nm |
200 |
300 |
500 |
N/A |
Minimum Trench Width, nm |
400 |
500 |
1000 |
N/A |
Transparent Defects: |
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|
|
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Transparent Defect Repair |
N/A |
Yes |
N/A |
N/A |
Minimum Edge Defect Size, nm |
N/A |
300* |
N/A |
N/A |
Minimum Isolated Defect Size, nm |
N/A |
300* |
N/A |
N/A |
Minimum Trench Width, nm |
N/A |
800* |
N/A |
N/A |
* Free area around the defect should be no less than 500nm. Repair of transparent defects may be performed in two stages: deposition + evaporation. |
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