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EМ-5131B Laser-based mask defect repair system |
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The tool allows to repair masks with various masking coating: chromium, chromium oxide, and iron oxide.
Main features:
- removal of opaque defects;
- repair of transparent defects;
- femtosecond laser allows to perform damage-free processing of the mask substrate;
- TV observation of defect finding, alignment and stage travel to the specified zone of a defect;
- angular mask orientation and reference system binding;
- process parameter setting in automatic and manual modes.
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Specifications
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Minimum diametr of defects under repaired, µm: |
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| - transparent |
0.25 |
| - opaque |
0.25 |
| Working field size, mm |
160х160 |
| Angular position of an area under repair, degrees,° |
0...90 |
| Accuracy of laser beam pointing at an opaque defect, nm |
100 |
| Opaque defect programmable size resolution, nm |
100 |
| Power consumption, not more than, kW |
4 |
Performance specification
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30X |
7.5X |
| Objective Lens Working Distance |
4.9 mm |
18 mm |
| Maximum Pellicle Height |
N/A |
N/A |
| XY Stage Minimum Step Size |
10 nm |
10 nm |
| XY Stage Defect Navigation Accuracy |
±1 um |
±1 um |
| Edge Placement Accuracy |
±100 nm |
±500 nm |
| Opaque Defects: |
Yes |
No |
| Minimum Edge Defect Size |
500 nm |
N/A |
| Minimum Isolated Defect Size |
500 nm |
N/A |
| Minimum Trench Width |
1000 nm |
N/A |
| Transparent Defects: |
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| Transparent Defect Repair |
N/A |
N/A |
| Minimum Edge Defect Size |
N/A |
N/A |
| Minimum Isolated Defect Size |
N/A |
N/A |
| Minimum Trench Width |
N/A |
N/A |
* Free area around the defect should be no less than 500nm. Repair of transparent defects may be performed in two stages: deposition + evaporation.
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