PLANAR (KBTEM)
 
EМ-5181B Laser-based mask defect repair system

The tool allows to repair masks with various masking coating: chromium, chromium oxide, and iron oxide.

Main features:

  • removal of opaque defects;
  • repair of transparent defects;
  • femtosecond laser allows to perform damage-free processing of the mask substrate;
  • TV observation of defect finding, alignment and stage travel to the specified zone of a defect;
  • angular mask orientation and reference system binding;
  • process parameter setting in automatic and manual modes.

SPECIFICATIONS

Minimum diametr of defects under repaired, µm:
 
- transparent 1
- opaque0.5
Working field size, mm160х160
Angular position of an area under repair, degrees,°±45
Accuracy of laser beam pointing at an opaque defect, nm500
Opaque defect programmable size resolution, nm100
Power consumption, not more than, kW4

 

PERFORMANCE SPECIFICATION

Objective lens magnification 100x 75x 30x 7.5x
Objective Lens Working Distance, mm 2,2 7,5 7,5 18
XY Stage Minimum Step Size, nm 50 50 50 50
XY Stage Defect Navigation Accuracy, um ±5 ±5 ±5 N/A
Edge Placement Accuracy, nm ±50 ±70 ±100 N/A
Opaque Defects: Yes Yes Yes No
Minimum Edge Defect Size, nm 500 700 1000 N/A
Minimum Isolated Defect Size, nm 500 700 1000 N/A
Minimum Trench Width, nm 1000 1400 2000 N/A
Transparent Defects:        
Transparent Defect Repair N/A Yes N/A N/A
Minimum Edge Defect Size, nm N/A 500* N/A N/A
Minimum Isolated Defect Size, nm N/A 500* N/A N/A
Minimum Trench Width, nm N/A 1000* N/A N/A
* Free area around the defect should be no less than 500nm. Repair of transparent defects may be performed in two stages: deposition + evaporation.