Planar JSC
EМ-5131B Laser-based mask defect repair system


EМ-5131 Laser-based mask defect repair system

The tool allows to repair masks with various masking coating: chromium, chromium oxide, and iron oxide.

Main features:

  • removal of opaque defects;
  • repair of transparent defects;
  • femtosecond laser allows to perform damage-free processing of the mask substrate;
  • TV observation of defect finding, alignment and stage travel to the specified zone of a defect;
  • angular mask orientation and reference system binding;
  • process parameter setting in automatic and manual modes.



Minimum diametr of defects under repaired, µm:
- transparent  0.25
- opaque 0.25
Working field size, mm 160х160
Angular position of an area under repair, degrees,° 0...90
Accuracy of laser beam pointing at an opaque defect, nm 100
Opaque defect programmable size resolution, nm 100
Power consumption, not more than, kW 4


Performance specification

30X 7.5X
Objective Lens Working Distance 4.9 mm 18 mm
Maximum Pellicle Height N/A N/A
XY Stage Minimum Step Size 10 nm 10 nm
XY Stage Defect Navigation Accuracy ±1 um ±1 um
Edge Placement Accuracy ±100 nm ±500 nm
Opaque Defects: Yes No
Minimum Edge Defect Size 500 nm N/A
Minimum Isolated Defect Size 500 nm N/A
Minimum Trench Width 1000 nm N/A
Transparent Defects:
Transparent Defect Repair N/A N/A
Minimum Edge Defect Size N/A N/A
Minimum Isolated Defect Size N/A N/A
Minimum Trench Width N/A N/A


* Free area around the defect should be no less than 500nm. Repair of transparent defects may be performed in two stages: deposition + evaporation.