PLANAR (KBTEM)
 
EM-5884 Projection photo assembly system for wafer exposure

 

The EM-5884 system is intended for mask-to-wafer projection imaging and its replication on wafers with photo assembly for 0.35 um node VLSI fabrication.

SPECIFICATIONS

Operating wavelength, nm354.7
Reduction ratio1:5
Numerical aperture0.45-0.6
Photo assembly pattern field size, X and Y, mm22x22
Minimal feature size on patterned field, um0.35
Wafer size, mm150 or 200
Reticle size, mm153x153x6,3
Pellicle frame height, not more than, mm6.0