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EM-5884 Projection photo assembly system for wafer exposure

 

EM-5884 Projection photo assembly system for wafer exposure

The EM-5884 system is intended for mask-to-wafer projection imaging and its replication on wafers with photo assembly for 0.35 um node VLSI fabrication

 

Specifications 

Operating wavelength, nm 354.7
Reduction ratio 1:5
Numerical aperture 0.45-0.6
Pattern field size, X and Y, mm 11x22
Photo assembly pattern field size, X and Y, mm 22x22
Minimal feature size on patterned field, um 0.35
Wafer size, mm 150 or 200
Reticle size, mm 153x153x6,3
Pellicle frame height, not more than, mm 6.0