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EM-6022 Automatic spectral ellipsometry system |
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EM-6022 Automatic Spectral Ellipsometry System is intended for high precision inspection of film thicknesses and multi-layer thin film structures as well as their optical constants on wafers by contact-free nondestructive method.
For full scale semiconductor fabrication, the system enables measuring optical constants and thicknesses of single- and multi-layers such as silicon oxides, silicon nitrides, photoresists etc. on ordinary wafers and inspection wafers.
EM-6022 features latest and most advanced achievements of several domains of modern technology:
- Use of LED;
- Use of SMIF;
- Robotic loading/unloading;
- Use of IT.
Automated operations for operator’s convenience and throughput increase:
- Pattern area navigation.
- Automatic pattern-based focusing.
- Horizontal and vertical sample motion.
- Loading/unloading.
- Statistical inspection data processing.
Specifications
Inspection time for one point, s:
minimal
average |
2
10 | | Spectral range, nm | 190-1000 | | Wafer diameter, mm | 100, 150, 200 | | Spot size, um | 2000-5000 | | Spot size with nozzle (perpendicular light incidence), um | 100 | | Transparent film thickness inspection range, nm | 0,1-35000 | | Work field size, mm | 200х200 |
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PLANAR (KBTEM)