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EM-6022 AUTOMATIC SPECTRAL ELLIPSOMETRY SYSTEM

 

EM-6022 AUTOMATIC SPECTRAL ELLIPSOMETRY SYSTEM


EM-6022 Automatic Spectral Ellipsometry System is intended for high precision inspection of film thicknesses and multi-layer thin film structures as well as their optical constants on wafers by contact-free nondestructive method. For full scale semiconductor fabrication, the system enables measuring optical constants and thicknesses of single- and multi-layers such as silicon oxides, silicon nitrides, photoresists etc. on ordinary wafers and inspection wafers.

 

EM-6022 features latest and most advanced achievements of several domains of modern technology:

  • Use of LED;
  • Use of SMIF;
  • Robotic loading/unloading;
  • Use of IT.

Automated operations for operator’s convenience and throughput increase:

  • Pattern area navigation.
  • Automatic pattern-based focusing.
  • Horizontal and vertical sample motion.
  • Loading/unloading.
  • Statistical inspection data processing.

 

Specifications

Inspection time for one point, s:
minimal
average

2
10
Spectral range, nm 190-1000
Wafer diameter, mm 100, 150, 200
Spot size, um 2000-5000
Spot size with nozzle (perpendicular light incidence), um 100
Transparent film thickness inspection range, nm 0,1-35000
Work field size, mm 200х200