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EM-5126 is the first fully automatic mask aligner developed by Planar JSC.
This device has a complete set of automatic units: loading wafers from cassettes, orientation on the base cut, transfer to the alignment table, thickness calibration, flatness alignment, alignment with a photomask, positioning at predetermined imaging gap, imaging and unloading of the wafer into the cassette.
| Wafer diameter, mm | 150 | | Wafer thickness, mm | 0.4 ... 0.8 | | Mask size, mm | 177.8х177.8 | | Mask thickness, mm | 3.15; 3.9; 6.45 | | Photolithography resolution for vacuum contact, um, not more than | 0.6 ... 0.8 | | Primary exposure mode throughput (without alignment time; for 1 s exposure time), wafers/hour | 140
| | Automatic alignment time (±0.5 to ±0.05 um preset accuracy), s | 10 ... 60 | | Gap between mask and wafer for alignment and exposure, um | 0 ... 40 | | Exposure wavelength range*, nm | 225-260; 280-330;350-450 | | Ø150 mm workfield illumination non-uniformity, %, not more than | ±2.5 | | Microscope-to-23” display color image magnification, x (Automatic focusing. Automatic illumination adjustment.) | 250; 500; 1000 | | Adjustable distance between microscope objective lens axes, mm | 80 ... 130 | | Mercury-xenon lamp power (DRKs-500), W | 500 | | Power consumption, W, not more than | 855 | | Weight, kg | 450 | | Overall dimensions, L х W х H, mm | 1290 х 1225 х 1550 | | *To be specified before PO |
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PLANAR (KBTEM)