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EM-5231 LARGE-FIELD LASER-BASED MASK DEFECT REPAIR SYSTEM

 

EM-5231 LARGE-FIELD LASER-BASED MASK DEFECT REPAIR SYSTEM 

EM-5231 system is intended for repair of 5”, 6”, 7”, 9” masks with opaque and transparent defects: mouse bites, protrusions, shorts between features, corner rounding etc.
The system enables repair of 2.2 mm to 6.45 mm masks with various coating types: chrome, chrome oxide, iron oxide.

Optical density and adhesive properties of repairable transparent and opaque defects are in compliance with SEMI standards. The system is in compliance with the interstate laser tool safety standard IEC 60825-1-2013, technical regulations of the Customs Union 004/2011 (low voltage equipment safety).

 

Specifications

Isolated defect repair Yes
Edge defect repair Yes
Pellicle-through repair Yes (75x and 30x)
Use of defect files from inspection tools Yes
Patter copy repair Yes
Operation in transmitted light Yes
Operation in reflected light Yes
Illuminator wavelength 257.5 nm
Laser wavelength 257.5 nm evaporation
488 nm deposition
Laser pulse time <300 fs
Objective lenses 100x, 75x, 30x, 7.5x
Travel range along Z 5 mm
Repair part rotation for evaporation +\- 45°
Mask load type Semiautomatic
Operational stability ≥90% Uptime
Footprint 15 m2

 

Performance specification

Objective lens magnification 100x 75x 30x
Objective lens working distance 2.2 mm 7.1 mm 7.5 mm
Maximum pellicle height N/A 6.3 mm 6.3 mm
XY stage minimum step size 10 nm 10 nm 10 nm
XY stage defect navigation accuracy ±1 um ±1 um ±1 um
Edge placement accuracy ±50 nm ±70 nm ±100 nm
Opaque defects: Yes Yes Yes
Minimum edge defect size 100 nm 200 nm 500 nm
Minimum isolated defect size 150 nm 250 nm 500 nm
Minimum trench width 400 nm 500 nm 1000 nm
Transparent defect:
Transparent defect repair N/A Yes N/A
Minimum edge defect size N/A 300 nm* N/A
Minimum isolated defect size N/A 300 nm* N/A
Minimum trench width N/A 600 nm* N/A

 

* Free space around the defect should be ≤ 0.5 um. Repair of transparent defects is performed by deposition with subsequent evaporation.