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EM-6015M1 system is intended for dimension
inspection and detection of mask and wafer pattern defects and
contamination in microelectronic item fabrication process.
However, its application domain can be extended to
materials science, mechanical engineering, metallography,
criminalistics, restoration, production of new materials and research in
universities and educational institutions.
Main features:
- telecentric optics;
- laser-based automatic focusing;
- pattern comparison function, software-based magnification adjustment, panoramic border-located pattern fragment butting etc.;
- calibration by measurement of certified dimensions on the test object;
- LED application to increase light source service life and reduce power consumption;
- vibration dampening.
Automated features:
- Horizontal and vertical sample travel.
- Objective lens changeover for magnification change.
- Light intensity adjustment.
- Focusing (dynamic laser focusing and static pattern-based focusing).
- Micro structure dimensions inspection.
- Inspected structure area navigation.
- Statistical inspection data processing.
SPECIFICATIONS
| Number of objective lenses, pcs. | 3 | | Minimal objective lens flange focal distance, mm | 10 | | Objective lens NA | 0,15 ... 0,5 | | Objective lens magnification | 5х ... 50х | | Objective lens field of view, mm | 0.44 ... 4,4 | | Display field of view (diagonal), mm | 0,3 ... 3 | | Eyepieces magnification | 10 | | Useful e-magnification | 40 | | Overall magnification of eyepieces-assisted observation | 50х ... 500х | | Overall magnification of display-assisted observation | up to 2000х | | Video camera resolution, Mp | 8 | | Display definition | 4K | | Coordinated stage travel for X, Y, and Z, mm | 200х200х27 | | Overall dimensions, LхWхH, m | 1,2х0,8х1,5 | | Power consumption from 230V mains, W, not more than | 700 | | Weight, kg, not more than | 175 | | Maximal power consumption, W, not more than | 700 |
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PLANAR (KBTEM)
