«КБТЭМ-ОМО»
ОТКРЫТОЕ АКЦИОНЕРНОЕ ОБЩЕСТВО
 
EM-5106 MASK ALIGNER

 

ЭМ-5106 Mask Aligner

 

Specifications 

Wafer diameter, mm 150
Wafer thickness, mm 0,4 ... 0,8
Mask size, mm 177,8 х 177,8
Mask thickness, mm 3 ... 3,9
Photolithography resolution during vacuum contact, um, not more than 0,6 ... 0,8
Alignment accuracy random component, um ±0.1
Pre-orientation accuracy and wafer-to-workstage transfer accuracy, along X and Y, um, and along Θ, degree, not more than: X, Y = ±15;
Θ = ± 0,01
Throughput in primary exposure mode (excluding alignment time for 1 s exposure time), wafer/hour 140
Wafer manipulator travel range along Х axis and Y axis, mm, and along Θ, angle, degree, not less than Х, Y = ± 3     Θ = ± 10
Alignment manipulator drive sensitivity along X and Y, um, and along Θ angle, second Х, Y< 0,01
Θ < 0,1
Mask manipulator travel range along Х axis and Y axis, mm and along Θ angle, degree Х, Y = ± 2      Θ = ± 3
Gap between mask and wafer for alignment and exposure, um 0 ... 40
Exposure wavelength ranges*, nm 225-260; 280-330;
350-450
Ø 150 mm exposure field illumination uniformity, %, not more than ±2.5
Two-field microscope magnification with split field and smooth magnification adjustment
- 10х eyepieces and ОМ-0.2/14.5 (ОМ1-0.4/8) objective lenses, x
- together with color video camera for 23” display size, x

85 … 270 (150 … 470)
225 … 560 (400 … 1000)
Adjustable distance between microscope objective axes, mm 32 … 129
Microscope manipulator travel along Х and Y, mm Х, Y = ± 25
Mercury-xenon lamp power (DRKs-500)**, W 500
Power consumption, W, not more than 800
Weight, kg 420,0
Overall dimensions, L х W х H, mm 1290 х 1225 х 1520


* Subject to customer requirements
** Possible use of LED optical exposure units for low power consumption and long service life.